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BS IEC 62047-47:2024
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of bending strength microstructures
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 08/28/2024 |
| Page Count | 20 |
| Themes | Electromechanical devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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