Active
Standard
Most Recent
BS IEC 63068-2:2019
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method using optical inspection
Preview
Summary
Inspection;Test methods;Silicon carbide;Defects;Electronic equipment and components;Integrated circuit technology;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 02/08/2019 |
| Page Count | 28 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.