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BS IEC 63378-2-1:2024
Thermal standardization on semiconductor packages 3D thermal simulation models of for steady-state analysis. Discrete
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/29/2024 |
| Page Count | 18 |
| Themes | Models (testing) |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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