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DIN 50456-3:1999-08

Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Part 3: Determination of cationic impurities

Summary

The document defines a method for the determination of Na, K and CA in moulding compounds for electronic components by analysis of an aqueous extract of the epoxy resin moulding compound by means of the pressure cooker test according to DIN 50456-2.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 08/01/1999
Cancellation Date 05/01/2015
Page Count 2
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ISBN ---
Weight (in grams) ---
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