Superseded
Standard
Historical
DIN EN 60068-2-54:2007-01
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006); German version EN 60068-2-54:2006.
Preview
Summary
This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Notes
DIN IEC 60068-2-54 (1988-01) remains valid alongside this standard until 2009-07-01.*A transition period, as set out in DIN EN 60068-2-69 (2018-01), exists until 2020-04-11.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2007 |
| Cancellation Date | 01/01/2018 |
| Page Count | 21 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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