Superseded
Standard
Historical
DIN EN 60068-2-69:2007-11
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007); German version EN 60068-2-69:2007.
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Summary
This part of IEC 60068 outlines Test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices.
Notes
DIN EN 60068-2-69 (1996-08) remains valid alongside this standard until 2010-06-01.*A transition period, as set out in DIN EN 60068-2-69 (2018-01), exists until 2020-04-11.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 11/01/2007 |
| Cancellation Date | 01/01/2018 |
| Page Count | 27 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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