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DIN EN 60191-3 Beiblatt 1:2006-08
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
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Summary
This supplement contains a comparison of the English and German terms which are used in the series IEC 60191 for semiconductor packages.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2006 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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