Superseded Draft amendment
Historical

DIN EN 60191-4/A1:2017-04

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)

Summary

This Amendment 1 to DIN EN 60191-4:2014-10 adds a new Annex C, Terminology of semiconductor package outline. This standard describes a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

Notes

Prévu comme amendement à DIN EN 60191-4 (2014-10).

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 04/01/2017
Cancellation Date 02/01/2019
Page Count 34
EAN ---
ISBN ---
Weight (in grams) ---
No products.

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