Superseded
Draft amendment
Historical
DIN EN 60191-4/A1:2017-04
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)
Summary
This Amendment 1 to DIN EN 60191-4:2014-10 adds a new Annex C, Terminology of semiconductor package outline. This standard describes a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
Notes
Prévu comme amendement à DIN EN 60191-4 (2014-10).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 04/01/2017 |
| Cancellation Date | 02/01/2019 |
| Page Count | 34 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
01/03/2003
Superseded
Historical