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DIN EN 60191-6-1:2002-08
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
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Summary
The document covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4. This publication is intended to establish common rules on terminal shapes irrespective of package types.
Notes
À remplacer par DIN IEC 60191-6-1 (2010-07).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2002 |
| Page Count | 10 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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