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DIN EN 60191-6-13:2017-06
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016.
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Summary
This part of DIN EN 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Notes
DIN EN 60191-6-13 (2008-04) remains valid alongside this standard until 2019-11-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2017 |
| Page Count | 20 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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