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DIN EN 60191-6-2:2002-09
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
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Summary
The document covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tage ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 09/01/2002 |
| Page Count | 14 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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