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DIN EN 60191-6-21:2011-03
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
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Summary
This part of DIN EN 60191 specifies (or: covers) methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 03/01/2011 |
| Page Count | 17 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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