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DIN EN 60191-6-22:2013-08
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
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Summary
This part from IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2013 |
| Page Count | 18 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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