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DIN EN 60191-6-3:2001-06
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
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Summary
The document stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2001 |
| Page Count | 16 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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