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DIN EN 60191-6-4:2004-01
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
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Summary
This part of DIN EN 60191 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2004 |
| Page Count | 20 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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