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DIN EN 60191-6-5:2002-05
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
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Summary
The document provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminals pitch is less than, or equal to 0,80 mm and whose package body outline is square.
Notes
À remplacer par DIN IEC 60191-6-5 (2010-01).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 05/01/2002 |
| Page Count | 11 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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