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DIN EN 60191-6-8:2002-05
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
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Summary
The document provides outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (G-QFP).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 05/01/2002 |
| Page Count | 14 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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