Superseded
Standard
Historical
DIN EN 60286-3:2008-04
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2007); German version EN 60286-3:2007.
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Summary
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Notes
DIN EN 60286-3 (1998-12) remains valid alongside this standard until 2010-09-01.*A transition period, as set out in DIN EN 60286-3 (2014-02), exists until 2016-06-21.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 04/01/2008 |
| Cancellation Date | 02/01/2014 |
| Page Count | 30 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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