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DIN EN 60749-14:2004-07
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003.
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Summary
This part of IEC 60749 provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Notes
Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2006-10-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2004 |
| Page Count | 19 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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