Superseded
Standard
Historical
DIN EN 60749-15:2011-06
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010); German version EN 60749-15:2010 + AC:2011.
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Summary
This part of DIN EN 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
Notes
DIN EN 60749-15 (2003-10) remains valid alongside this standard until 2013-12-01.*A transition period, as set out in DIN EN IEC 60749-15 (2022-05), exists until 2023-08-18.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2011 |
| Page Count | 11 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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