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DIN EN 60749-16:2003-09
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
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Summary
The test described in this standard is used to detet the presence of loose particles inside a cavity device, such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
Notes
Pour le(s) document(s) annulé(s) et non remplacé(s) DIN 41881-2 (1978-06) l'éditeur recommande ce document.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 09/01/2003 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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