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DIN EN 60749-20-1:2009-10
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
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Summary
This part of DIN EN 60749 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. This standard specifies the handling conditions for SMDs subjected to the test conditions of DIN EN 60749-20.
Notes
À remplacer par DIN EN IEC 60749-20-1 (2018-11).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 10/01/2009 |
| Page Count | 39 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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