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DIN EN 60749-22:2003-12
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003.
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Summary
The project is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to measure bond strength or determine compliance with specified bond strength requirements.
Notes
Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2005-10-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 12/01/2003 |
| Page Count | 20 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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