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DIN EN 60749-25:2004-04
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003.
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Summary
This part of DIN EN 60749 provides a test procedure for determining the ability of smiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremen. Permanent changes in electrical and/or physical characteristics can result from these stresses. This test applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Notes
Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2006-09-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 04/01/2004 |
| Page Count | 15 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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