Superseded
Standard
Historical
DIN EN 60749-37:2008-08
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008.
Preview
Summary
This part of DIN EN 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
Notes
A transition period, as set out in DIN EN IEC 60749-37 (2023-12), exists until 2025-11-16.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2008 |
| Page Count | 22 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.