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DIN EN 61188-5-8:2008-07
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008.
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Summary
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands.
Notes
Applies in conjunction with DIN EN 61188-5-1 (2003-06)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2008 |
| Page Count | 31 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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