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DIN EN 61189-3:2008-06
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008.
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Summary
This part of IEC 61189 is a cataloque of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Notes
DIN EN 61189-3 (2000-08) remains valid alongside this standard until 2010-12-01.*Applies in conjunction with DIN EN 60068 Reihe
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2008 |
| Page Count | 120 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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