Superseded
Draft standard
Historical
DIN EN 61189-5-601:2018-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English
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Summary
This standard specifies the reflow soldering ability test method for the solder joint of the surface mount device (SMD) mounted on the organic rigid printed boards, reflow heat resistance test method for the organic rigid printed boards, and reflow soldering ability test method for the organic rigid printed boards land in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 11/01/2018 |
| Page Count | 72 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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