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DIN EN 61191-2:2018-05

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017.

Summary

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e. g. through-hole, chip mounting, terminal mounting, etc.).

Notes

DIN EN 61191-2 (2014-02) remains valid alongside this standard until 2020-10-13.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 05/01/2018
Page Count 36
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