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DIN EN 61191-6:2011-01
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010
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Summary
This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2011 |
| Page Count | 42 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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