DIN EN 61760-4:2018-09
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DIN EN 61760-4:2018-09

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018.

Summary

This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.

Notes

DIN EN 61760-4 (2016-03) remains valid alongside this standard until 2021-04-17.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 09/01/2018
Page Count 38
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ISBN ---
Weight (in grams) ---
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