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DIN EN 62047-12:2012-06
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
Summary
This document specifies a method for fatigue testing using the resonant vibration of the microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This document applies to vibrating structures ranging in size from 10 µm to 1000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in thickness.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2012 |
| Page Count | 31 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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