Active Standard
Most Recent

DIN EN 62047-12:2012-06

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011

Summary

This document specifies a method for fatigue testing using the resonant vibration of the microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This document applies to vibrating structures ranging in size from 10 µm to 1000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in thickness.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 06/01/2012
Page Count 31
EAN ---
ISBN ---
Weight (in grams) ---
No products.