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DIN EN 62047-15:2016-01
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015); German version EN 62047-15:2015
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Summary
This part of DIN EN 62047 specifies general procedures for bonding strength test of MEMS devices between poly dimethyl siloxane (PDMS) and glass chip.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2016 |
| Page Count | 13 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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