Superseded
Draft standard
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DIN EN 62047-18:2011-06
Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials (IEC 47F/76/CD:2011)
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Summary
This ducument specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2011 |
| Cancellation Date | 04/01/2014 |
| Page Count | 20 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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