Superseded Draft standard
Historical

DIN EN 62047-26:2014-05

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)

Summary

This part of IEC 62047 specifies terms and definition, description of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,0067 to 20. For needle structures, the standard applies to structures with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 05/01/2014
Cancellation Date 12/01/2016
Page Count 53
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