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DIN EN 62137-1-3:2009-07
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009
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Summary
The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2009 |
| Page Count | 24 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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