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DIN EN 62137-1-4:2009-08
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009
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Summary
The test method described in this part of IEC 62137 applies to surface mount components with a thin an wide basal plane, such as QFP and BGA. This test methods evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2009 |
| Page Count | 15 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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