Superseded
Standard
Historical
DIN EN 62137:2005-04
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004.
Preview
Summary
This Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages an peripheral terminal type packages.
Notes
A transition period, as set out in DIN EN 62137-4 (2015-07), exists until 2017-11-13.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 04/01/2005 |
| Cancellation Date | 07/01/2015 |
| Page Count | 29 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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