Superseded Draft standard
Historical

DIN EN 62326-18:2013-07

Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods (IEC 91/1083/CD:2013)

Summary

This document described the test methods of passive and active device embedded substrates. The basis test methods of printed wiring substrate materials and substrates themselves are described in IEC 61189-2 and IEC 61189-3 series documents.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 07/01/2013
Cancellation Date 03/01/2016
Page Count 59
EAN ---
ISBN ---
Weight (in grams) ---
No products.