Superseded
Draft standard
Historical
DIN EN 62326-18:2013-07
Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods (IEC 91/1083/CD:2013)
Summary
This document described the test methods of passive and active device embedded substrates. The basis test methods of printed wiring substrate materials and substrates themselves are described in IEC 61189-2 and IEC 61189-3 series documents.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2013 |
| Cancellation Date | 03/01/2016 |
| Page Count | 59 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
01/07/2013
Superseded
Historical