DIN EN 62483:2012-05

The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). This specification does not apply to components with bottom-only terminations where the full plated surface is wetted during assembly (for example: quad flat no leads and ball grid array components, flip chip bump terminations).