DIN EN IEC 61190-1-3:2018-09
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DIN EN IEC 61190-1-3:2018-09

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018.

Summary

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.

Notes

DIN EN 61190-1-3 (2011-04) remains valid alongside this standard until 2021-01-17.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 09/01/2018
Page Count 44
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ISBN ---
Weight (in grams) ---
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