Superseded
Draft standard
Historical
DIN EN ISO 9453:2019-10
Soft solder alloys - Chemical compositions and forms (ISO/DIS 9453:2019); German and English version prEN ISO 9453:2019
Summary
This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of: - tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 10/01/2019 |
| Page Count | 36 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
01/05/2005
Superseded
Historical