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DIN IEC 47D/275/CDV:1999-07
Semiconductor devices, mechanical standardization - Package outline for plastic fine pitch quad flat pack (FQFP) family, S-R.QPF XXXE (Intended for inclusion into IEC 60191-2) (IEC 47D/275/CDV:1999)
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Summary
Halbleiterbauelemente, Mechanische Normung - Plastik-FQFP-Gehäusefamilie, S-R.QPF XXXE (vorgesehen zur Aufnahme in IEC 60191-2) (IEC 47D/275/CDV:1999)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/1999 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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