Withdrawn
Draft standard
Most Recent
DIN IEC 61249-3-1:2008-05
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
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Summary
This PAS specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 05/01/2008 |
| Page Count | 63 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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