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DIN IEC 62047-11:2010-06
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)
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Summary
This dociment specifies the test method to measure the linear thermal expansion coefficients (CTE) of thin freestanding solid (metallic, ceramic, polymeric etc.) MEMS materials with length and width under 1 mm and thickness under 10 µm, which are main structural materials used for MEMS, micromachine and others. The continuous as well as average CTE values can be measured with this test method up to 150 °C. It also includes the essential requirements for testing equipment.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 06/01/2010 |
| Cancellation Date | 04/01/2014 |
| Page Count | 24 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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