Superseded
Draft standard
Historical
DIN IEC 62047-13:2010-05
Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
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Summary
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit mikromechanischer Strukturen (IEC 47F/44/CD:2010)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 05/01/2010 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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