DIN IEC/TS 62326-17*DIN SPEC 42326-17:2013-07
Withdrawn Draft standard
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DIN IEC/TS 62326-17*DIN SPEC 42326-17:2013-07

Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)

Summary

This document describes the test element group devices useful in measurement of basic properties of device embedded substrates. Device embedded structures may embed various types of devices from passive, active and mechanical components.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 07/01/2013
Page Count 61
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Weight (in grams) ---
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