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DIN IEC/TS 62647-3*DIN SPEC 42647-3:2013-12
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes (IEC 107/213/DTS:2013)
Summary
This technical specification defines for circuit card assemblies (CCA): - a default method for those companies that require a pre-defined approach and - a protocol for those companies that wish to develop their own test methods.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 12/01/2013 |
| Page Count | 79 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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