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DIN IEC/TS 62647-3*DIN SPEC 42647-3:2013-12

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes (IEC 107/213/DTS:2013)

Summary

This technical specification defines for circuit card assemblies (CCA): - a default method for those companies that require a pre-defined approach and - a protocol for those companies that wish to develop their own test methods.

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 12/01/2013
Page Count 79
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