IEC 60068-2-69:2017/AMD1:2019
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IEC 60068-2-69:2017/AMD1:2019

IEC 60068-2-69:2017/AMD1:2019 Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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Publisher International Electrotechnical Commission (IEC)
Publication Date 06/19/2019
Edition 3.0
Page Count 13
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Weight (in grams) ---

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