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IEC 60191-4:2013
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Summary
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 10/10/2013 |
| Edition | 3.0 |
| Page Count | 48 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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